Tape carrier assemblies having an integrated adhesive film

ABSTRACT

Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.62/551,758, titled “Tape Carrier Assemblies Having an IntegratedAdhesive Film” and filed on Aug. 29, 2017, which is incorporated byreference herein in its entirety.

RELATED FIELD

The present technology relates to carrier tapes for protectingsemiconductor components and, more specifically, carrier tapes having anintegrated adhesive film for holding the semiconductor components inplace.

BACKGROUND

Several different configurations have been used to facilitate thetransportation of semiconductor components (e.g., semiconductor wafersor semiconductor dies) between different manufacturing/testing sites,namely, stick magazines, injection-molded trays, and carrier tapes. Forexample, carriers often transport semiconductor components from onelocation to another location to facilitate the manufacture of integratedcircuits (ICs) from the semiconductor components. This is especiallytrue for carriers who are members of the Joint Electron DeviceEngineering Council (JEDEC), which has established standards for safehandling, transport, and storage of ICs, modules, and othersemiconductor components.

Stick magazines (also referred to as a “shipping tubes”) can be used totransport and store semiconductor components between the manufacturingsite and the assembly site. Stick magazines are also used to feedsemiconductor components to automatic-placement machines for surfacemounting and through-hole mounting.

Injection-molded trays contain semiconductor components duringcomponent-assembly operations, during transport from the manufacturingsite to the assembly site, and when feeding the semiconductor componentsto automatic-placement machines for surface mounting on boardassemblies. Shipping trays are typically designed for semiconductorcomponents that have leads on four sides (e.g., Quad Flat Package (QFP)and thin QFP (TQFP) packages) and that require lead isolation duringshipping, handling, or processing.

Carrier tape can be used for transport from the manufacturing site tothe assembly site, as well as storage at the assembly site. Carrier tape(which is often wound around a reel) is designed for feedingsemiconductor components to automatic-placement machines for surfacemounting on board assemblies.

However, these configurations exhibit several limits on, for example,the optimum quantity of semiconductor components per square area due tothe limits of individual component retention, the lateral movementduring the manufacturing/testing processes due to the design limitationsof individual punched cavities (which can contribute to unwantedsemiconductor components being inadvertently damaged from handling),etc. Such limitations lead to low manufacturing/handling capacity andhigh testing costs.

BRIEF DESCRIPTION OF THE DRAWINGS

Various features of the technology will become more apparent to thoseskilled in the art from a study of the Detailed Description inconjunction with the drawings. Embodiments of the technology areillustrated by way of example and not limitation in the drawings, inwhich like references may indicate similar elements.

FIG. 1 illustrates how a carrier tape can include a series of cavities(also referred to as “pockets”) that are designed to hold semiconductorcomponents and a cover tape that seals the semiconductor components inthe cavities.

FIG. 2 is a top plan view of a carrier tape that includes a series ofcavities disposed along a central mounting portion.

FIG. 3 is a top section view of an adhesive film disposed between a topcover and a bottom cover.

FIG. 4 is a top section view of a carrier tape assembly that includes anadhesive film affixed to a carrier tape.

FIG. 5 is a cross-section view of a carrier tape including a punchedcavity with a central indentation, an adhesive film, and a top cover.

FIG. 6 is a cross-section view of a carrier tape including punchedcavities with central indentations and an adhesive film.

FIG. 7 is a top section view showing a semiconductor component mountedto an adhesive film continuously laminated along the top surface of acarrier tape.

FIG. 8 depicts a process for manufacturing a carrier tape assembly thatincludes an adhesive film affixed to the top surface of a carrier tape.

The drawings depict various embodiments for the purpose of illustrationonly. Those skilled in the art will recognize that alternativeembodiments may be employed without departing from the principles of thetechnology. Accordingly, while specific embodiments are shown in thedrawings, the technology is amenable to various modifications.

DETAILED DESCRIPTION

Carrier tape provides protection to semiconductor components fromphysical damage and electrostatic discharge (ESD) damage during shippingand storage. Carrier tape is often used for presenting semiconductorcomponents to automatic-placement machines (also referred to as“pick-and-place machines”) for automatic placement onto printed circuitboards. Examples of semiconductor components include semiconductorwafers, semiconductor dies (e.g., bumped die or bare die), and otherelectronic components used in the fabricated of integrated circuits(ICs).

FIG. 1 illustrates how a carrier tape 100 can include a series ofcavities 102 (also referred to as “pockets”) that are designed to holdsemiconductor components and a cover tape 106 that seals thesemiconductor components within the cavities 102. Carrier tape 100 isoften used in the semiconductor industry because it can reliably preventsemiconductor components from being mechanically/structurally damagedand manipulate electrical properties as required to meet ESD ProtectedArea (EPA) requirements. However, carrier tape 100 suffers from severaldrawbacks, including low semiconductor component density (and thus lowmanufacturing/handling capacity) and high testing costs.

Introduced here, therefore, are carrier tape assemblies that improveefficiency and reduce costs when utilized in the transport ofsemiconductor components during manufacturing processes and/or testingprocesses. A carrier tape assembly can include an adhesive film affixedto an elongate carrier tape. For example, the adhesive film may belaminated onto the top surface of the elongate carrier tape (includingany punched cavities) as a single continuous sheet. Proper securement ofthe semiconductor components to the carrier tape assembly depends on thetackiness of the constituent material(s) of the adhesive film.

Additional information on the installation of adhesive films, as well asthe placement of semiconductor components, can be found in U.S.application Ser. No. ______, titled “Rigid Carrier Assemblies having anIntegrated Adhesive Film,” which is incorporated by reference herein inits entirety.

Terminology

References in this description to “an embodiment” or “one embodiment”means that the particular feature, function, structure, orcharacteristic being described is included in at least one embodiment.Occurrences of such phrases do not necessarily refer to the sameembodiment, nor are they necessarily referring to alternativeembodiments that are mutually exclusive of one another.

Unless the context clearly requires otherwise, the words “comprise” andcomprising” are to be construed in an inclusive sense rather than anexclusive or exhaustive sense (i.e., in the sense of “including but notlimited to”). The terms “connected,” “coupled,” or any variant thereofis intended to include any connection or coupling, either direct orindirect, between two or more elements. The coupling/connection can bephysical, logical, or a combination thereof. For example, two devicesmay be electrically and/or communicatively coupled to one another.

When used in reference to a list of multiple items, the word “or” isintended to cover all of the following interpretations: any of the itemsin the list, all of the items in the list, and any combination of itemsin the list.

Technology Overview

FIG. 2 is a top plan view of a carrier tape 200 that includes a seriesof cavities 202 disposed along a central mounting portion 204. Thecentral mounting portion 204 is interposed between opposing sideportions 206 a-b, which are connected to the central mounting portion204 by pitched sidewalls. In some embodiments, the carrier tape 200 is apre-formed carrier tape (e.g., a thermoformed carrier tape) havingembossed cavities 202. The carrier tape 200 can be comprised ofpolystyrene, polyester, polyimide, or a combination thereof.

The carrier tape 200 can include an array of sprocket holes 210 linearlyarranged along at least one of the opposing side portions 206 a-b. Here,for example, sprocket holes 210 have been punched through side portion206 a of the carrier tape 200. While FIG. 2 only shows sprocket holes210 along one of the opposing side portions, sprocket holes 210 could bepunched through both opposing side portions 206 a-b. The sprocket holes210 can be used (e.g., by an automatic-placement machine) for conveyingand positioning the carrier tape 200.

Characteristics of the carrier tape 200 (e.g., length and width) may bedesigned such that the carrier tape 200 is a JEDEC-compliant mediacarrier. Thus, in some embodiments the carrier tape 200 has a specificheight, width, and/or length that allows the carrier tape assembliesintroduced here to be utilized for the placement of semiconductorcomponents in JEDEC-compliant processes. JEDEC-compliant carrier tapeassemblies may also have a specified density of cavities 202, and eachof the cavities 202 may also have a specific height, width, and/orlength.

JEDEC compliance may also require a central indentation 208 (or someother structural feature) within each cavity 202. The indentation 208may be configured to interlock with a complementary structural feature(e.g., a protruding feature) disposed along the outer surface of asemiconductor component. The complementary structural features (i.e.,the indentation 208 and the protruding feature) are intended to hold thesemiconductor component within the cavity 202 in a specifiedorientation. Those skilled in the art will recognize that theindentation 208 could also be replaced with a protruding feature, inwhich case the outer surface of the semiconductor component may havesome type of indentation adapted to receive the protruding feature.

FIG. 3 is a top section view of an adhesive film 304 disposed between atop cover 302 and a bottom cover 306. The adhesive film 304 (alsoreferred to as a “film tape”) can be affixed to the top surface of acarrier tape (e.g., carrier tape 200 of FIG. 2) as a single continuoussheet without any breaks. This can be done in several different ways,including via a lamination process, a spray process, or a co-extrusionprocess.

Here, the adhesive film 304 includes a top cover 302 affixed to the topsurface and a bottom cover 306 affixed to a bottom surface. The bottomcover 306 can be removed from the adhesive film 304 before the bottomsurface of the adhesive film 304 is affixed to the top surface of thecarrier tape. The top cover 302, meanwhile, may be removed from the topsurface of the adhesive film 304 before semiconductor component(s) areaffixed to the adhesive film 304 (and thus to the carrier tape).

Those skilled in the art will recognize that the top cover 302 and/orthe bottom cover 306 may not be present in every embodiment. Forinstance, a bottom cover 306 is unnecessary when the adhesive film 304is sprayed directly onto the top surface of the carrier tape. Similarly,a top cover 302 may not be present if semiconductor component(s) are tobe secured to the adhesive film 304 soon after the adhesive film 304 isaffixed to the top surface of the carrier tape. Accordingly, the term“adhesive layer” may include some or all of these layers (e.g., an“adhesive layer” may only include the adhesive film 304).

The adhesive film 304 can be mounted to the carrier tape such that theadhesive film 304 is laminated along the entirety of the top surface ofthe carrier tape (including any cavities, such as pre-formed,JEDEC-compliant punched cavities). The adhesive film 304 can becomprised of any suitable adhesive film having sufficient tackiness,while the top cover 302 and the bottom cover 306 can be comprised of anysuitable material capable of being readily removed from the adhesivefilm 304.

FIG. 4 is a top section view of a carrier tape assembly that includes anadhesive film 402 affixed to a carrier tape 400. More specifically, thecarrier tape assembly includes an adhesive film 402 integrally mounted(e.g., through lamination) to the continuously-punched central mountingportion of the carrier tape 400. The adhesive film 402 can be bonded toa flat area 404 on the deck on one or both ends of the carrier tape 400.

As noted above, a top cover (e.g., top cover 302 of FIG. 3) may bedetachably secured to the top surface of the adhesive film 402. In suchembodiments, the top cover can be readily removed from the top surfaceof the adhesive film 402 by being peeled beginning at the flat deck area404, which may include a pull tab or some other feature that facilitateseasy removal.

The surface adhesion (also referred to as “tackiness”) of the adhesivefilm 402 holds semiconductor components (e.g., semiconductor wafers orsemiconductor dies) in place as the carrier tape assembly moves. Forexample, the adhesive film 402 can hold the semiconductor components ina specified orientation during transport/storage or as the semiconductorcomponents are separated/detached through manual or mechanicalautomation during a manufacturing process or testing process. Theadhesive film 402 can ensure that the semiconductor components do notmove when the carrier tape 400 is rotated along the x-axis, y-axis, orz-axis, or moved vertically/horizontally with respect to, for example,an automatic-placement machine.

As shown here, the adhesive film 402 can be affixed to the centralmounting portion of the carrier tape 400 in a single continuous sheetalong the entire length of the carrier tape 400. That is, the adhesivefilm 402 can be affixed along the entire length of the carrier tape 400including any cavities, such as pre-formed, JEDEC-compliant punchedcavities. The adhesive film 402 generally does not cover the sideportions disposed along the outer edges of the carrier tape 400.However, the adhesive film 402 may at least partially cover the pitchedsidewalls that connect the central mounting portion to the sideportions. Thus, the adhesive film 402 could be secured to the pitchedsidewalls leading up to the side portions or the side portionsthemselves

Together, the adhesive film 402 and the carrier tape 400 form a carriertape assembly that can be used to universally transport media (e.g.,singulated silicon wafers or silicon die of the same or different sizes)as necessary for manufacturing, shipping, and/or storing.

FIG. 5 is a cross-section view of a carrier tape including a punchedcavity 502 with a central indentation 504, an adhesive film 506, and atop cover 508. The top cover 508 may ensure that the top surface of theadhesive film 506 remains sticky, and thus may be removed a short timebefore a semiconductor component is secured within the punched cavity502.

The adhesive film 506 can be integrally secured along a central mountingportion of the carrier tape such that the adhesive film 506 conforms tothe design of the punched cavity 502. However, the adhesive film 506 mayextend across the central indentation 504 as shown here. Consequently,when a semiconductor component is secured within the punched cavity 502,a protruding feature disposed along the outer surface of thesemiconductor component may pierce the adhesive film 506 wheninterconnected within the central indentation 504.

Note, however, that the adhesive film 506 could also conform to thedesign of the central indentation 504. In such embodiments, theprotruding feature of the semiconductor component does not pierce theadhesive film 506, but instead is securably held within the centralindentation 504 by the adhesive film 506.

The adhesive film 506 and the top cover 508 may be applied in the samestep or different steps. For example, the adhesive film 506 and the topcover 508 may be simultaneously applied after a bottom cover (e.g.,bottom cover 306 of FIG. 3) has been removed. As another example, theadhesive film 506 may be applied via a spraying process or aco-extrusion process, and then the top cover 508 may be subsequentlyapplied. In some embodiments, the top cover 508 may simply not bepresent at all.

FIG. 6 is a cross-section view of a carrier tape including punchedcavities 502 with central indentations 504 and an adhesive film 506. Insome embodiments, the carrier tape includes an array of punched cavities502 that are linearly arranged along a central mounting portioninterposed between opposing side portions. At least one of the opposingside portions typically includes sprocket holes 512 that can be used forconveying and positioning the carrier tape.

The adhesive film 506 can conform to the design of the central mountingportion of the carrier tape. Thus, the adhesive film 506 may cover thecentral indentation 504 within each punched cavity 502 and thelatitudinal sides of each punched cavity 502, but the adhesive film 506may not cover the longitudinal sides of each punched cavity 502. Thelongitudinal sides are defined by the sidewalls 510 of the punchedcavity 502 and run parallel to the side portions of the carrier tape,while the latitudinal sides are orthogonal to the longitudinal sides.

In some embodiments, a relief break 514 may be present between some orall of the punched cavities 502. The relief break(s) 514 can be formedin a similar manner as the punched cavities 502 (e.g., punched/moldedduring a thermoforming manufacturing process). The type/placement ofrelief break(s) 514 and the type of adhesive film 506 can be selectedbased on desired impact on camber, flexibility (particularly about thepunched cavities 502), propagation prevention (e.g., of semiconductorcomponents from cavity to cavity), etc. The pitch of the sidewallsconnecting the central mounting portion to the opposing side portionsmay also affect some of these items.

The adhesive film 506 serves to hold semiconductor component(s) in placeas opposed to conventional carrier tape configurations that rely on thephysical specifications of the cavity walls and floor, as well as covertape. Because the adhesive film 506 can be used on its own to securesemiconductor component(s) to the carrier tape, the carrier tape neednot necessarily have punched cavities 502. That is, a carrier tape mayhave a “pocketless” design and the semiconductor component(s) could besecured to the carrier tape solely by the adhesive film 506. Theflexibility of the adhesive film 506 also allows the punched cavities tohave non-conventional geometries (e.g., non-rectangular designs).

FIG. 7 is a top section view showing a semiconductor component 704mounted to an adhesive film 702 continuously laminated along the topsurface of a carrier tape 700. Together, the adhesive film 702 and thecarrier tape 700 form a carrier tape assembly capable of transportingand storing semiconductor components 704 in a space-efficient,cost-efficient manner.

The semiconductor component 704 can utilize the adhesive film 702 (aswell as a punched cavity) to position/seat itself in a specifiedposition relative to the remainder of the carrier tape assembly. Forexample, each semiconductor component 704 may include a structuralfeature (e.g., a protruding feature) designed to interlock with acomplementary structural feature (e.g., an indentation) of a cavity ofthe carrier tape 700. The complementary structural features are intendedto hold the semiconductor component 704 in a specified orientationduring transport between various processes (e.g., manufacturingprocesses and testing processes of an integrated circuit), sites (e.g.,manufacturing sites and assembly sites), etc.

When interconnected with the central indentation of a cavity, aprotruding feature of the semiconductor component 704 may pierce theadhesive film 702. The remainder of the bottom surface of thesemiconductor component 704 may stick to the adhesive film 702. Thisenables a carrier tape assembly containing one or more semiconductorcomponents to be moved (e.g., vertically and/or laterally) withoutdisplacing the semiconductor components from their original orientation.

A tool can be manually or automatically operated to pick up thesemiconductor component 704 from the carrier tape assembly, therebyreleasing the semiconductor component 704 from the adhesive film 702 inpreparation for the next process (e.g., a manufacturing, testing, orstoring process).

A cover tape intended to hold the semiconductor component(s) 704 inplace may also be affixed over the semiconductor component(s) 704. Forexample, the cover tape may be disposed over the cavity within which thesemiconductor component 704 is secured. In such embodiments, the covertape may contact the top surface of the semiconductor component 704. Thecover tape must be removed before the tool detaches the semiconductorcomponent 704 from the adhesive film 702. Removal of the cover tape anddetaching of the semiconductor component 704 may be completed by thesame tool or a different tool.

Another object of the technology introduced here is to provide atechnique for pre-setting an adhesive film to be affixed (e.g.,integrally laminated) to a carrier tape (e.g., an embossed carrier tape)in a simple, reliable manner within a short period of time. FIG. 8depicts a process 800 for manufacturing a carrier tape assembly thatincludes an adhesive film affixed to the top surface of a carrier tape.

A manufacturer initially receives an elongate flexible tape (step 801).The elongate flexible tape can be comprised of polystyrene, polyester,polyimide, or a combination thereof. The elongate flexible tape isgenerally sufficiently flexible such that it can be coiled in a reel,which can be presented to an automatic-placement machine for placementof semiconductor components onto printed circuit boards.

The manufacturer can mold the elongate flexible tape to include acentral mounting portion interposed between opposing side portions (step802). As shown in FIG. 2, the central mounting portion may be on a firstplane below the opposing side portions, which are on a second plane thatis parallel to, but higher than, the first plane. The depth of thecentral mounting portion (which is defined by the difference between thefirst plane and the second plane) can be modified based on the pitch ofthe sidewalls connecting the central mounting portion to the opposingside portions.

The manufacturer can then form at least one cavity in the top surface ofthe central mounting portion of the elongate flexible tape (step 803).The size and/or depth of the at least one cavity may vary based on thesize of the semiconductor component expected to be placed within eachcavity. The manufacturer may also perforate an array of sprocket holesalong at least one of the opposing side portions (step 804). Thesprocket holes are used to convey and position the elongate flexibletape.

The manufacturer can secure an adhesive film to the top surface of theelongate flexible tape (step 805). For example, the adhesive film may beaffixed to the elongate flexible tape as a single continuous (i.e.,unbroken) sheet. This can be done in several different ways, includingvia a lamination process, a spray process, or a co-extrusion process.The adhesive film may have sufficient bonding strength such that it canbe integrally mounted into each cavity formed in the top surface of theelongate flexible tape. Semiconductor components may utilize the surfaceenergy and/or tackiness of the adhesive film for seating attachment at acertain density (e.g., a maximum continuous density) along the centralmounting portion of the elongate flexible tape.

Because semiconductor components can be mounted directly to the adhesivefilm rather than via dedicated structural features (e.g., indentationsand protruding features), the carrier tape assembly can include a higherdensity/count of semiconductor components. In fact, the density/countmay be determined based on the intended application of the carrier tapeassembly in manufacturing, transporting, storing, and/or testingprocesses.

Unless contrary to physical possibility, it is envisioned that the stepsdescribed above may be performed in various sequences and combinations.For example, in some embodiments the elongate flexible tape is apre-formed carrier tape having embossed cavities. Thus, in someinstances the manufacturer may not be required to mold the elongateflexible tape, punch any cavities, or perforate any sprocket holes.Instead, the manufacturer may simply secure the adhesive film to thepre-formed carrier tape (which could be produced by a differentmanufacturer or the same manufacturer at an earlier point in time).

Additional steps could also be included in some embodiments. Forexample, the manufacturer (or some other entity) may subsequently secureone or more semiconductor components to the adhesive film of the carriertape assembly. Moreover, once the semiconductor component(s) have beensecured to the carrier tape assembly, a cover tape may be used to holdthe semiconductor component(s) in place. The cover tape may only be usedin certain situations (e.g., long-distance transport or long-termstorage) where the carrier tape assembly and semiconductor componentsare expected to undergo bumping, shaking, etc.

Although some embodiments are described in the context of certainsemiconductor components (e.g., semiconductor wafers or semiconductordies), those skilled in the art will readily appreciate that thetechnology can be used to secure other electronic components as well.

REMARKS

The foregoing examples of various embodiments have been provided for thepurposes of illustration and description. These examples are notintended to be exhaustive. Many variations will be apparent to oneskilled in the art. Certain embodiments were chosen in order to bestdescribe the principles of the technology introduced herein, therebyenabling others skilled in the relevant art to understand the claimedsubject matter, the various embodiments, and the variations that may besuited to particular uses.

The language used in the specification has been principally selected forreadability and instructional purposes. It may not have been selected todelineate or circumscribe the subject matter. Therefore, it is intendedthat the scope of the technology be limited not by this specification,but rather by any claims that issue based hereon. Accordingly, thedisclosure of the technology is intended to be illustrative (rather thanlimiting) of the scope of the technology, which is set forth in thefollowing claims.

What is claimed is:
 1. A carrier tape assembly comprising: athermoformed carrier tape having a top surface that includes a lineararray of embossed cavities, wherein each embossed cavity includes acentral indentation for interlocking a protruding feature disposed alongan outer surface of a semiconductor component; an adhesive filmintegrally laminated on the top surface of the carrier tape as a singlecontinuous sheet, wherein the adhesive film conforms to the linear arrayof embossed cavities, and wherein the adhesive film aids in thesecurement of semiconductor components within the linear array ofembossed cavities; and a cover tape disposed over the linear array ofembossed cavities.
 2. A carrier tape assembly comprising: a carrier tapehaving a top surface that includes a punched cavity; and an adhesivefilm laminated on the top surface of the carrier tape as a singlecontinuous sheet, wherein the adhesive film is configured to secure asemiconductor device within the punched cavity of the carrier tape. 3.The carrier tape assembly of claim 2, wherein the carrier tape includesan indentation in the punched cavity.
 4. The carrier tape assembly ofclaim 3, wherein the semiconductor device includes a protruding featureconfigured to interlock the indentation in the punched cavity of thecarrier tape.
 5. The carrier tape assembly of claim 4, wherein theprotruding feature of the semiconductor device pierces the adhesive filmwhen interlocked within the indentation in the punched cavity of thecarrier tape.
 6. The carrier tape assembly of claim 2, furthercomprising: a cover tape disposed over the punched cavity of the carriertape.
 7. The carrier tape assembly of claim 2, wherein the carrier tapeis comprised of polystyrene, polyester, polyimide, or a combinationthereof.
 8. The carrier tape assembly of claim 2, wherein the carriertape includes an array of sprocket holes linearly arranged along anouter edge of the carrier tape, and wherein the array of sprocket holesare used for conveying and positioning the carrier tape assembly.
 9. Thecarrier tape assembly of claim 2, wherein the punched cavity is one ofmultiple punched cavities that are arranged in a linear pattern along alength of the carrier tape.
 10. A method of manufacturing a carrier tapeassembly, the method comprising: receiving an elongate flexible tape;punching a cavity for receiving a semiconductor device into a topsurface of the elongate flexible tape; and securing an adhesive film tothe top surface of the elongate flexible tape as a single continuoussheet.
 11. The method of claim 10, further comprising: molding theelongate flexible tape to include a central mounting portion interposedbetween opposing side portions.
 12. The method of claim 11, furthercomprising: perforating an array of sprocket holes linearly along atleast one opposing side portion of the elongate flexible tape.
 13. Themethod of claim 11, wherein the central mounting portion is connected tothe opposing side portions by pitched sidewalls.
 14. The method of claim11, wherein the central mounting portion includes the cavity forreceiving the semiconductor device.
 15. A carrier tape assemblycomprising: an embossed carrier tape; an adhesive film affixed to a topsurface of the embossed carrier tape; and a semiconductor device securedto the embossed carrier tape by the adhesive film.
 16. The carrier tapeassembly of claim 15, wherein the embossed carrier tape includes apunched cavity for receiving the semiconductor device.
 17. The carriertape assembly of claim 16, wherein the semiconductor device includes aprotruding feature that pierces the adhesive film when the semiconductordevice is secured within the punched cavity of the embossed carrier tape18. The carrier tape assembly of claim 16, further comprising: a covertape disposed over the punched cavity of the embossed carrier tape. 19.The carrier tape assembly of claim 15, wherein the adhesive film holdsthe semiconductor device in a specified orientation on the embossedcarrier tape.
 20. The carrier tape assembly of claim 15, wherein theadhesive film is affixed to the top surface of the embossed carrier tapevia a lamination process, a spray process, or a co-extrusion process.21. The carrier tape assembly of claim 15, wherein the semiconductordevice is a semiconductor wafer or a semiconductor die.